Semiconductor Hermetic Packages for Precision Microelectronics

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Hermetic Packages Engineered for Demanding Environments

Complete Hermetics manufactures a full range of hermetic microwave, hybrid, power, photonic, and telecom packages designed for high-reliability applications in defense, aerospace, energy, medical, and advanced electronics industries. These hermetically sealed microelectronic enclosures are used in mission-critical environments where extreme temperature, vibration, pressure differentials, radiation, and chemical exposure can compromise sensitive semiconductor devices. Each package is engineered to protect internal circuitry, maintain signal integrity, and ensure decades of stable performance in harsh operating conditions.

Microwave and Hybrid Hermetic Packages

For RF, microwave, and millimeter-wave systems, Complete Hermetics produces precision hermetic microwave and hybrid packages compliant with MIL-883, MIL-PRF-38354, and JEDEC-9C standards. These packages incorporate customized feedthrough diameter combinations to meet complex impedance requirements, ensuring high-frequency stability and low-loss performance. Typical constructions include glass-to-metal seals, ceramic-to-metal seals, bent leads, and GPO connectors. Housing materials such as Kovar, stainless steels, CRS, Alloy 52/46, titanium, and aluminum provide controlled thermal expansion, structural robustness, and high-temperature endurance. Every unit undergoes stringent inspection including helium leak testing to ≤ ATM 1×10-8 cc/sec He, insulation resistance tests, and pin-pull tests to verify mechanical integrity.

High-Power Hermetic Packages for Thermal Demands

Complete Hermetics also manufactures hermetic power packages engineered to support high electrical loads and significant thermal dissipation. Many of these power enclosures utilize copper tungsten, copper molybdenum, and copper heat-spreading materials that effectively manage thermal expansion while allowing the enclosure to dissipate heat efficiently. These packages often incorporate glass feedthroughs, ceramic feedthroughs, and DIL/DIP packages with hermetic glass seals to ensure reliable electrical performance under high voltage and high current. Built to MIL-883/MIL-PRF-38354 specifications, each power package is tested for hermeticity, insulation resistance, pin strength, and dimensional accuracy to guarantee long-term durability in energy systems, aerospace modules, and industrial power equipment.

Photonic, Fiber-Optic, Telecom & Biomedical Hermetic Packages

For optical, telecom, and biomedical applications, Complete Hermetics produces hermetically sealed enclosures used in fiber-optic systems, photonic communication devices, biomedical diagnostics, and high-speed signal modules. These packages are built using durable materials including Kovar, stainless steels, CRS, Alloy 52/46, titanium, and aluminum, offering excellent thermal stability and corrosion resistance. Typical constructions include High-Temperature Co-Fired Ceramics (HTCC), multi-layer ceramic feedthroughs, glass-to-metal seals, and GPO or window-lens packages supporting optical coupling and high-frequency performance. With hermeticity levels of ≤ ATM 1×10-8 cc/sec He, these enclosures maintain optical clarity, electrical isolation, and mechanical precision even in harsh or sterilized environments. Complete Hermetics supports custom prototype development through full mass-production, ensuring tailored solutions for next-generation fiber-optic networks, photonic sensors, and biomedical instrumentation.

Commitment to Engineering Excellence

Across all package types—microwave, hybrid, power, photonic, telecom, and biomedical—Complete Hermetics engineering team works directly with customers to optimize design, material selection, sealing technologies, and testing protocols. Every hermetic package is built with strict process control and complete traceability, ensuring unmatched precision and customer satisfaction for high-performance semiconductor assemblies.

Contact Complete Hermetics:

Choose Complete Hermetics for ultra-reliable semiconductor hermetic packages and other advanced hermetic products engineered for advanced electronic systems.

Hermetically Sealed Packages for Harsh-Environment Electronics

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Purpose of Hermetic Packages

Hermetically sealed packages protect sensitive microelectronics against moisture, contaminants, chemical vapor, radiation, vacuum conditions, and extreme temperature cycles. Without hermetic protection, microchips, sensors, and laser components can suffer from corrosion, outgassing, electrical drift, or catastrophic failure. In aerospace, defense, semiconductor, and medical applications, hermetic packaging ensures long-term performance—even in environments where failure is not an option.

Types of Hermetic Packages Offered

Complete Hermetics manufactures hermetic microwave and hybrid packages for defense, aerospace, energy, and medical applications, delivering rugged microelectronic enclosures engineered for harsh environments where reliability is critical.

Complete Hermetics produces high-reliability hermetic power packages using copper tungsten, copper molybdenum, and copper materials to support high thermal expansion, efficient heat dissipation, and long-term hermetic performance through glass-to-metal or ceramic-to-metal seals.

Complete Hermetics manufactures hermetic packages for photonic, fiber-optic, telecom, and biomedical systems, enabling stable high-speed optical performance and providing fully customized solutions from prototype to production.

Precision Sealing & Manufacturing Process

Hermetic packages are sealed using laser welding, seam sealing, brazing, or glass-to-metal sealing depending on mechanical, thermal, and electrical requirements. Complete Hermetics ensures proper metallization, plating, internal routing, and thermal expansion matching to guarantee structural and environmental reliability. Internal cavities can be customized for chip alignment, lens coupling, fiber-optic feedthroughs, or high-speed signal pathways.

Applications in Demanding Industries

These packages are used in:

  • Satellites and deep-space communications
  • Radar & military electronics
  • Medical diagnostic technology
  • Semiconductor laser drivers
  • Harsh-environment sensor modules
  • High-reliability communication systems

Contact Complete Hermetics:

Choose Complete Hermetics for high-performance hermetically sealed packages engineered for extreme reliability and precision.