Category: Semiconductor Hermetic Packages

Hermetic Packages Engineered for Demanding Environments

Complete Hermetics manufactures a full range of hermetic microwave, hybrid, power, photonic, and telecom packages designed for high-reliability applications in defense, aerospace, energy, medical, and advanced electronics industries. These hermetically sealed microelectronic enclosures are used in mission-critical environments where extreme temperature, vibration, pressure differentials, radiation, and chemical exposure can compromise sensitive semiconductor devices. Each package is engineered to protect internal circuitry, maintain signal integrity, and ensure decades of stable performance in harsh operating conditions.

Microwave and Hybrid Hermetic Packages

For RF, microwave, and millimeter-wave systems, Complete Hermetics produces precision hermetic microwave and hybrid packages compliant with MIL-883, MIL-PRF-38354, and JEDEC-9C standards. These packages incorporate customized feedthrough diameter combinations to meet complex impedance requirements, ensuring high-frequency stability and low-loss performance. Typical constructions include glass-to-metal seals, ceramic-to-metal seals, bent leads, and GPO connectors. Housing materials such as Kovar, stainless steels, CRS, Alloy 52/46, titanium, and aluminum provide controlled thermal expansion, structural robustness, and high-temperature endurance. Every unit undergoes stringent inspection including helium leak testing to ≤ ATM 1×10-8 cc/sec He, insulation resistance tests, and pin-pull tests to verify mechanical integrity.

High-Power Hermetic Packages for Thermal Demands

Complete Hermetics also manufactures hermetic power packages engineered to support high electrical loads and significant thermal dissipation. Many of these power enclosures utilize copper tungsten, copper molybdenum, and copper heat-spreading materials that effectively manage thermal expansion while allowing the enclosure to dissipate heat efficiently. These packages often incorporate glass feedthroughs, ceramic feedthroughs, and DIL/DIP packages with hermetic glass seals to ensure reliable electrical performance under high voltage and high current. Built to MIL-883/MIL-PRF-38354 specifications, each power package is tested for hermeticity, insulation resistance, pin strength, and dimensional accuracy to guarantee long-term durability in energy systems, aerospace modules, and industrial power equipment.

Photonic, Fiber-Optic, Telecom & Biomedical Hermetic Packages

For optical, telecom, and biomedical applications, Complete Hermetics produces hermetically sealed enclosures used in fiber-optic systems, photonic communication devices, biomedical diagnostics, and high-speed signal modules. These packages are built using durable materials including Kovar, stainless steels, CRS, Alloy 52/46, titanium, and aluminum, offering excellent thermal stability and corrosion resistance. Typical constructions include High-Temperature Co-Fired Ceramics (HTCC), multi-layer ceramic feedthroughs, glass-to-metal seals, and GPO or window-lens packages supporting optical coupling and high-frequency performance. With hermeticity levels of ≤ ATM 1×10-8 cc/sec He, these enclosures maintain optical clarity, electrical isolation, and mechanical precision even in harsh or sterilized environments. Complete Hermetics supports custom prototype development through full mass-production, ensuring tailored solutions for next-generation fiber-optic networks, photonic sensors, and biomedical instrumentation.

Commitment to Engineering Excellence

Across all package types—microwave, hybrid, power, photonic, telecom, and biomedical—Complete Hermetics engineering team works directly with customers to optimize design, material selection, sealing technologies, and testing protocols. Every hermetic package is built with strict process control and complete traceability, ensuring unmatched precision and customer satisfaction for high-performance semiconductor assemblies.