LASER SCRIBE/CUTTING ON CERAMIC SUBSTRATES
High precision laser scribe/cutting and drilling on ceramic substrates are available.
Ceramic Substrates:
- 96% Al2O3: Thick Film Hybrid Circuit, Resistors, Thermal Electric/Power Modules
- 99.6% Al2O3 : Thick Film Circuits, Power Hybrid Circuits
- Aluminum Nitride : Thick Film Hybrid, High Density Electronic Packages, Power Modules
- 95% Al2O3 : Engineering structural applications and wear/corrosion resistant applications
High Precision Laser Process:
- Lengths and widths up to 7½" x 5 ½"
- Thickness Tolerance: +/-0.05mm
- Scribing Width: ≥ 0.10mm
- Hole Diameter: ≥ 0.20mm
- Hold Diameter Tolerance: +/-0.08mm for hole up to 2.0mm
- Tolerance between holes: +/-0.05mm
Partial Customer List:
